The higher operating temperatures of high-brightness LEDs drastically reduce lumen output, decrease lifetime, and produce color shifts. For achieving optimum heat-sinking with the best possible TCE match to III-V materials, High-Performance Packaging of LEDs has concentrated on five basic materials categories: high thermal conductivity metals (copper, aluminum), high thermal conductivity ceramics (BeO, AlN), metal matrix composites (AlSiC), ceramic matrix composites (diamond in SiC), and polymer matrix composites (carbon-fiber filled epoxy). This talk will address the challenges of characterizing the actual thermal performance of these packaging materials for LEDs.
Abstract and registration details at: http://imapsne.org/ChapterMeeting.html
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Forum: LEDs - # of views: 1096
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