Who will handle post-fab processes?

The fabs will be doing the TSVs, that seems clear. I think sophisticated OSATs stand the best chance of success in the evolving 3D market. However, we may see a new entity that truely exists in the middle. The complexity that 3D drives and the difficulties that are going to occur in the standards development gives a large business window for a 3D fab. A foundry with no front end. I see this as more of a foundry outgrowth rather than a fab, because of the complexity.

Bob,

I agree with you that the fabs seem best suited for doing TSVs. If the standards around handling bonded and thinned wafers were worked out, would there be a reason why a fab could not do more than just the TSVs? In that case, it would be a question of which entity (fab or SAT) would possess the technical expertise for mid to long-term development and the capability for capital expenditure.

Discussion Summary

While fabs are the most likely to handle TSV fabrication, there's still question as to whether OSATS or a third party will handle post TSV processes including wafer backside processing, thinning, stacking and bonding.