Forum: 3D IC Supply Chain Issues |
Welcome to the first day of the 3D Brightspots IC forum. This first round of questions across the topics is directed to all the panelists.
Post fab processes are identified as backgrinding (thinning), bonding, microbumping and stacking. In your opinion, should these processed fall to the fabs, OSATS or another party?
Bob,
I agree with you that the fabs seem best suited for doing TSVs. If the standards around handling bonded and thinned wafers were worked out, would there be a reason why a fab could not do more than just the TSVs? In that case, it would be a question of which entity (fab or SAT) would possess the technical expertise for mid to long-term development and the capability for capital expenditure.
Discussion Summary
While fabs are the most likely to handle TSV fabrication, there's still question as to whether OSATS or a third party will handle post TSV processes including wafer backside processing, thinning, stacking and bonding.