I think physical testing on the thermal side of the puzzle is required to verify such things as bonding techniques within the LED package, final design qualification, and manufacturing consistency at the production line. Test can complement analysis by providing validated thermal models to create more accurate predictive models. Analysis can complement test by assisting in the interpretation of test results, and reducing the number of tests performed.
I think physical testing on the thermal side of the puzzle is required to verify such things as bonding techniques within the LED package, final design qualification, and manufacturing consistency at the production line. Test can complement analysis by providing validated thermal models to create more accurate predictive models. Analysis can complement test by assisting in the interpretation of test results, and reducing the number of tests performed.
It can also potentially decrease the number of physical prototypes built. At least that's what I've found.
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