As the feasibility of TSVs has been well established in the
semiconductor industry, the focus has now shifted to the
manufacturability and integration of all the different building blocks
for TSVs and 3D Interconnects. At this year’s IMAPS International 2009,
Nov 1-5 , San Jose CA, Dr. Thorsten Matthias, Director of Technology,
EVG North America. will present a paper titled Lithography and Wafer
Bonding Solutions for 3D Integration, with emphasis on the integration
of all these process steps. As a preview to this presentation, 3D
InCites has invited Dr. Mathias to give a sneak preview of what
attendees will learn, as well as offering an opportunity to pose
questions prior to the event itself.
http://www.semineedle.com/posting/24948?snc=0
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