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Which real-world applications cannot be served by 2D multi-chip modules?
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Heterogeneous integration—of digital with analog or RF or MEMS—in a 3D stack would allow fast local interconnects between circuit blocks; which real-world applications cannot be served by global interconnects in 2D multi-chip modules?
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By
Ed Korczynski
on Jul 09, 2009
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BrightSpots 3D IC Forum
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Lithography Workshop: Smaller vs Taller. Extended Discussion
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- Lithography Workshop: Smaller vs Taller. Extended Discussion