Just like the shift from wire bonding to flipchip changed the rolls of fabs and assembly houses, 3D is doing the same. And just as flipchip created the 3rd party bumping operations, like Flipchip Int., we will see some new 3D focused manufacturers. This is not to say that current OSATs will not also enter this field and some arguably already have. Small circuit level TSVs will be done at the fabs. Bigger, via last TSVs will likely be done at the new 3D manufacturers. Die to die 3D will be the domain of the more sophisticated current OSATs.
The value brought by the 3D manufacturer in the near term will exceed that of OSAT and probably the fabs even, because the number of suppliers that can address the market with a complete supply chain is very small.
I would say that ourselves, (Tezzaron), Ziptronix, and Zycube would fit that description, although all of us are very low volume. At a package 3D level Irvine Sensors comes to mind as a company that really specializes in just 3D packaging.
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